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This work addresses the problem of thermal activity calculations for one of the most common spacecraft payload – multilayered circuit boards.

The problem arises due to the increase of electronics’ thermal design power (TDP) and thus stating the problem of predicting the behavior of different components while being placed in vacuum and exposed to large temperature gradients.

The paper overviews a number of existing methods for simplified thermal calculations and compares them on a typical example.

Then the technique of injecting the solid layer of copper in the specifically organized circuit boards to help to dissipate the generated heat from the electronic components under conditions of vacuum is analyzed.

The physical experiment on defining the effective thermal conductivity, which was conducted within the research, is described. Then the results of processing the data obtained through the calculation of computer model of experiment sample with the help of the SolidWorks software are presented.

The efficiency of simplified thermal modeling for circuit boards is shown through the example of calculating the Spektr-RG`s hardware complex thermal distribution.

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