The Technique through Simulation of Typical Assemblies of Radioelectronic Devices Spacecraft

Final qualification work on the theme "Methodology of end-to-end simulation model of printed circuit assemblies electronic devices of spacecrafts" is devoted to the design procedure and the design of multilayer printed circuit boards of electronic equipment of spacecraft in modern CAD tools, as for example, the design of a printed circuit Assembly processor module, which is structurally complete component of a memory module of two units of the storage device, the target information onboard a high-speed radio link; thermal simulation for the device that should be able to maintain its characteristics when exposed to external and internal thermal loads. The main objective of the work is the creation of engineering methods of modeling of printed circuit assemblies subject to exposure to elevated temperatures. This was carried out the thermal analysis module, which is the main ingredient of the design of the spacecraft subject to the requirements of the geometric, technological and thermophysical parameters. Recommendations were made for heat dissipation, which were taken into consideration in the simulation and printed Board Assembly design as a whole. Based on all of the above were developed iterative technique simulation of printed circuit assemblies.