Research of Electronic Components in Space Equipment under Thermal Influences

In this final qualifying work, the method of a priori analysis of the provision of a stock of heat load factors is being studied. Calculation of these coefficients is carried out to simulate the thermal processes occurring in the electronic components of the printed units of the electronic unit, which is part of the spaceborne spacecraft. The study of the above method is reduced to the study of thermal regimes at the stage of both the outline and the technical design of the apparatus. It should be taken into account that this method allows the developer to simulate the components of electronic equipment with multiple changes in internal heat, and also depending on the differences in ambient temperature. As a result of the simulation, the operating temperatures of the electronic components were obtained. Subsequently, the obtained data are compared with the maximum permissible values of these temperatures and their ratio forms such a parameter as the coefficients of the actual loads of electronic components. What is important, the stage of calculating such parameters precedes the manufacture of prototypes, which greatly facilitates the design and subsequent design of components of electronic units. The work provides a clear illustration of this method, the text of the work reflects the resulting coefficients of heat load and analyzed them. Keywords: modeling, radio-electronic equipment, spacecraft, thermal effects, electronic components; thermal load; heat exchange, model of thermal conditions.