The Use of Computer Simulation for the Analysis of Thermal Conditions in the Design of Information and Communication Devices

Student: Chuprinov Mikhail

Faculty: HSE Tikhonov Moscow Institute of Electronics and Mathematics (MIEM HSE)

Educational Programme: Infocommunication Technologies and Systems (Bachelor)

Final Grade: 7

Year of Graduation: 2019

As part of this diploma, the thermal processes in the computing module were modeled using the automated software ASONIKA-T and ASONIKA-TM. Also in this paper, a general analysis of the structure of the computing module was made; The analysis of the simulation results was carried out, the option of finalizing the cooling system of the unit was proposed.

Full text (added May 17, 2019)

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