Method for Determining of Electrophysical Parameters of High Density Interconnections (HDI)

Student: Rolina Valeriia

Supervisor: Leonid Kechiev

Faculty: HSE Tikhonov Moscow Institute of Electronics and Mathematics (MIEM HSE)

Educational Programme: Electronic Engineering (Master)

Final Grade: 9

Year of Graduation: 2019

This work is devoted to the study of technology of multilayer printed circuit boards of high density, methods of their manufacture, materials used, features and calculation of electrophysical parameters. Studies of this kind are designed to make the necessary clarifications to the existing methods for calculating the electrophysical parameters of HDI printed boards using the most up-to-date and complete information about this technology. The paper analyzes the existing standardized structures of multilayer printed circuit boards with increased density, various technologies for their manufacture, the main differences from the standard structure of a multilayer printed circuit board, features of using BGA and embedded components. The existing calculated ratios for the assessment of the electrical parameters of printed circuit boards are presented. After a complete analysis of the technology, corrections are proposed to the calculated ratios to clarify the impedance values, some comments and practical tips for designing high density printed circuit boards (HDI) are also provided.

Full text (added May 19, 2019)

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