Analysis of Stability of Printed Circuit Assemblies of Onboard Equipment to Mechanical Impacts

Student: Panteleev Mark

Faculty: HSE Tikhonov Moscow Institute of Electronics and Mathematics (MIEM HSE)

Educational Programme: Infocommunication Technologies and Systems (Bachelor)

Final Grade: 8

Year of Graduation: 2020

In the final qualification work, the types of mechanical loads on the onboard equipment were studied. Methods of increasing the stability of printed components to external mechanical loads are considered. A study was conducted using the automated system for ensuring the reliability and quality of ASONIKA-TM equipment, which resulted in load factors on all electronic components of the printing unit. Design changes were proposed to increase the stability of the printing unit to the impact of mechanical factors. The results of repeated modeling showed the correctness of the proposed solutions.

Full text (added May 16, 2020)

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