Modeling of Thermal Conditions of 3D Modular Constructions "Processor / Memory in a Package"

Student: Panichev Semen

Faculty: HSE Tikhonov Moscow Institute of Electronics and Mathematics (MIEM HSE)

Educational Programme: Electronic Engineering (Master)

Year of Graduation: 2020

The purpose of the work is to study the 3D modular constructions "processor / memory in a package" and modeling of thermal conditions depending on the parameters of their layers. 3D modular structures were investigated, such as, HS-PBGA, MCP-PBGA, HBM, Cross Section TMV PoP. The features of the influence of layers parameters on the temperature distribution and the maximum temperature are studied. The areas of application of these structures are considered. Basic requirements for the parameters of the layers are formulated, which give an effective heat removal from the crystals.

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