Identification of Damping Coefficients in Mechanical Models of Printed Circuit Boards of Radio Electronic Equipment

The final qualifying work is devoted to the problem of identifying damping coefficients for mechanical models of printed circuit boards of electronic equipment. In accordance with the set goal, the paper presents the theoretical foundations of modeling mechanical processes; describes the procedure for identifying damping coefficients using experimental modal analysis and by calculating the average value of the damping coefficient by the thermal conductivity coefficient. Since the estimation of this parameter using the dependence on the thermal conductivity coefficient had a large error, a method for identifying the damping coefficient by the first resonant frequencies was proposed. For this, a study of a series of printed circuit boards was carried out and, using the MATLAB program, a dependence was established in the form of a polynomial equation of the 7th degree. The described methods have been verified both with the help of experimental studies and with the help of modeling in the ANSYS system. The volume of the FQP is 42 pages, the number of tables is 9, the number of illustrations is 22, the number of formulas is 21. The list of references includes 6 sources.