Simulation of Thermal Operation Modes of a Printed Circuit Assembly

Student: Mirzoyan Lusine

Faculty: HSE Tikhonov Moscow Institute of Electronics and Mathematics (MIEM HSE)

Educational Programme: Infocommunication Technologies and Systems (Bachelor)

Year of Graduation: 2021

The present study was carried out to study the thermal modes of operation of the printed circuit assembly of the space equipment block. The general purpose of the work was to study and ensure stable operation under thermal loads of the feeder commutation board. The paper provides theoretical information about possible thermal loads, considered a software package that allows to simulate thermal modes of electronic printed circuit boards. As a result of the research carried out, improvements were proposed to the design of the printed circuit assembly to increase its resistance to thermal loads.

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