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Complex modeling of interconnected electro-thermal, electromagnetic, photoelectric and radiation effects and phenomena in micro- and nanoelectronic devices, circuits and systems

Priority areas of development: engineering science
2018
The project has been carried out as part of the HSE Program of Fundamental Studies.

Publications:


Petrosyants K. O., Nikita I. Ryabov, Boris G. Lvov, Ekaterina I. Batarueva Б. Е. Development of Compact SPICE-models of IC Resistive Interconnects with Different Configurations, in: 2018 Moscow Workshop on Electronic and Networking Technologies (MWENT). Proceedings. M. : IEEE, 2018. Ch. 10. P. 1-4. doi
Petrosyants K. O., Kozhukhov M. V., Dvornikov O. V., Savchenko E. M., Budyakov A. S. SPICE-model of SiGe HBT Taking into Account Radiation Effects, in: 2018 Moscow Workshop on Electronic and Networking Technologies (MWENT). Proceedings. M. : IEEE, 2018. Ch. 380. P. 1-4. doi
Kharitonov I. A. Application of electro-thermo-rad models for spice simulation of digital CMOS circuit behavior with account for combined thermal and radiation effects, in: Proceedings of the International Scientific – Practical Conference « INFORMATION INNOVATIVE TECHNOLOGIES» (I2T), 2018. , 2018. P. 475-481.
Uvaysov S. U. Proceedings of the International Scientific – Practical Conference « INFORMATION INNOVATIVE TECHNOLOGIES» (I2T), 2018. , 2018.