Development of Temperature Control System for Printed Board Assembly

The project is dedicated to the development of temperature control system for printed board assembly. The developed system consists of two modules and designed for sensor temperature control and positioning of the sensor over the elements mounted on the circuit nodes. The following goals and objectives were achieved and solved for implementation of the project: • Analysis of existing technical solutions used in temperature control systems. • Analysis of existing technical solutions used in temperature control systems. • Rationale of the system structure and the choice of tools and software. • Rationale for the use of interfaces, data transfer method. • Development of a circuit diagram of stepper motor controller. • Development of a circuit diagram of temperature measurement subsystem. • Assembling and testing of the stepper motor controller. • Assembling and testing the temperature measurement channel. • Development of structural scheme and algorithms of the system modules. • Development of software for the positioning subsystem. • Development of software for the temperature control subsystem. • Prototyping of designed modules and their experimental testing. The results constitute the basis for a practical use for educational purposes, the further development of the control systems and measurement and integration in research projects.