Simulation of High and Low Temperature Effects on Signal Waveforms in Traces of Integrated Circuit for Satellite Equipment

The present research belongs to investigations of modeling influence of temperature on transferring signals in conductors of integral schemes for space equipment. This paper includes graphs of dependence between output signals and temperature for different technologies and longs of interconnections. Interconnection of 0.25 um technology is modeled with CMOS-inverter temperature -80, 27, 80 ˚С. Time of delay and time of fronts were established and based on this graphs. ]Interconnection of 0.1um technology is modeled with CMOS-inverter temperature -150, -75, 25, 75, 150 ˚С. The key factors, which are considered: changing of MOSFET parameters in different temperature, changing parasitic parameters of interconnection in different temperature, influence of entering parameters to Spice-model on results. Time of delay and time of fronts were established and based on this graphs. Conclusion of influence of temperature on transferring signals in conductors of integral schemes was made.